3D Plus
Designs and manufactures miniaturized 3D-stacked microelectronic modules for space and defense applications
3D Plus, headquartered in Buc, France, builds miniaturized electronic modules by stacking heterogeneous active, passive, and opto-electronic devices into a single compact package. The product range covers memory, computer cores, interfaces, power solutions, camera heads, and custom System-in-Package solutions qualified for the demanding reliability requirements of satellite and space missions. The company was founded in 1995 and acquired by HEICO's Electronic Technologies Group in 2011. In 2022, 3D Plus acquired TRAD SAS, a French firm specializing in radiation testing and software for electronic components. Its products are not subject to US EAR or ITAR controls, allowing worldwide delivery. Components have accumulated flight heritage across GEO, MEO, and LEO orbits as well as deep space exploration missions.