3D Plus
French manufacturer of radiation-tolerant microelectronics and stacked memory modules for space and industrial use
3D Plus, founded in 1995 and based in Buc, France, designs and manufactures miniaturized 3D microelectronic modules for space, aerospace, defense, medical, and industrial markets. Its space-focused product line covers radiation-tolerant and rad-hard components including stacked memories, camera heads, interfaces, protection modules, and computer cores built to survive the orbital environment. Named missions carrying its hardware include Mars 2020, Rosetta, New Horizons, Juno, Parker Solar Probe, InSight, ISS, OneWeb, and Ariane 5. The company was founded by Christian Val and Pierre Maurice and is now a subsidiary of HEICO Corporation.